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Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
May 1, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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NEOTech Positions Itself as Microelectronics Industry Leader with High-Technology Investments
05/09/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announces a significant investment in acquiring new Palomar 8100 wire bonder machines, enhancing the company’s positioning as a leader of cutting-edge microelectronics assemblies for mission-critical applications.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX EXPO 2024
03/26/2024 | Ventec International GroupVentec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX EXPO 2024, April 9-11 on booth # 4309.
Mycronic's Global Technologies Makes Acquisition in Germany
03/22/2024 | MycronicMycronic’s Global Technologies division has signed an agreement to acquire Vanguard Automation, a company headquartered in Karlsruhe, Germany, which has developed a technology and automated equipment for 3D microfabrication of optical interconnects.