SEMI, UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
February 6, 2024 | SEMIEstimated reading time: 1 minute
SEMI announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.
Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.
Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.
“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”
Suggested Items
STMicroelectronics to Build First Fully Integrated Silicon Carbide Facility In Italy
05/31/2024 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces a new highvolume 200mm silicon carbide (“SiC”) manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy.
EOS Brings IPC Standards to South Korea
05/31/2024 | Tina Choi, IPC AsiaWe are well aware of the saying, “There are no borders in the world economy.” To grow, a company must think about establishing a global customer base, no matter how small the product. So, the product must be manufactured according to a common global standard. In electronics manufacturing, one South Korean company learned that IPC standards should be applied immediately.
SIA Applauds CHIPS Act Incentives for Absolics Project in Georgia
05/30/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Absolics, an affiliate of the Korea-based SKC.
SEACOMP Opens New Electronics Manufacturing Facility in Tijuana, Mexico
05/30/2024 | PRWEBSEACOMP, a USA-based electronics manufacturing services provider, has recently opened a new manufacturing facility in Tijuana, Mexico. This impressive 60,000 sq. ft. facility is just an hour south of SEACOMP's Carlsbad headquarters.
Sunshine PCB (Penang) Unveils Major Expansion Initiatives to Propel Growth and Innovation
05/30/2024 | Sunshine Global CircuitsSunshine Global Circuits (SGC) is renowned as a premier manufacturer of high-quality and cutting-edge PCBs. Specializing in a diverse range of requirements from high mix to low to high volumes and quick-turn prototypes, SGC boasts an impressive array of technical capabilities.